Published May 15, 2026

UB-Corning Research Advances Understanding of Ultrathin Glass

A collaboration between University at Buffalo researcher Jun Liu and Corning has produced its first peer-reviewed paper—marking an early milestone for a project supported through UB Business and Entrepreneur Partnerships’ Center of Excellence in Materials Informatics (CMI).

Funded through CMI’s Faculty Industry Applied Research (FIAR) program, the project focuses on contact electrification in ultrathin glass—or how materials become electrically charged through contact. In advanced displays, touchscreens and other electronics, that charging can attract particles, create defects and affect product quality and reliability.

The team’s first peer-reviewed paper, accepted by ACS Applied Materials & Interfaces, offers new insight into an issue with practical importance for advanced glass manufacturing.

For BEP, the milestone shows FIAR at work: connecting UB research with industry-relevant materials challenges.

The collaboration also created a direct student opportunity. First author and UB PhD student Aayush Nayyar will intern with Corning this summer.

Read the paper abstract