This project will develop a new electrical method for sensing the defects incurred during 3D metal printing.
Due to the high temperatures involved with 3D metal printing, the structure encounters much thermal stress during the printing process, thus resulting in defects and common warpage of the built structure. The alleviation of this problem requires monitoring the printing process, so that the defects can be sensed in real time during the printing and the printing condition can be adjusted in real time in order to correct for the problem. This means smart manufacturing.
Existing sensing methods mainly involve the use of cameras and temperature measurement. Cameras cannot detect the defects between the printed layers, as these defects are hidden from the view of the camera. The defects between the layers result from the thermal stress and are responsible for the common warpage. The temperature measurement can sense abnormalities in the printing process, but cannot sense defects. This project is aimed at providing an electrical method of sensing the defects. The project involves evaluating the effectiveness of the electrical method for the sensing of artificial interlayer defects of controlled location and size.
The project outcome will be a poster, a report and possibly also a peer-reviewed journal publication.
|Length of commitment||Year long (10-12 months)|
|Level of collaboration||Individual student project|
|Who is eligible||juniors, and seniors who have taken freshman-level physics and chemistry|
Once you begin the digital badge series, you will have access to all the necessary activities and instructions. Your mentor has indicated they would like you to also complete the specific preparation activities below. Please reference this when you get to Step 2 of the Preparation Phase.
View the following webpage.