Release Date: January 17, 2002
BUFFALO, N.Y. -- Jennie S. Hwang, founder and president of H-Technologies Group, Inc. of Cleveland, will discuss "Meeting Market Demands: New and Emerging Technologies for Electronic Packaging and Assemblies" during a lecture Feb. 8 as part of the Distinguished Women Speaker Series sponsored by the Institute for Research and Education on Women and Gender at the University at Buffalo.
The lecture, presented in conjunction with the Department of Mechanical and Aerospace Engineering at UB, will be held at 2 p.m. in 225 Natural Sciences Complex on the UB North (Amherst) Campus. A reception will follow.
The electronics/microelectronics industry has responded -- and will continue to respond -- to the needs of competitive products in the global marketplace. In her presentation, Hwang will provide a capsule view of key segments of electronics hierarchy in market needs and in the development of new technologies. Key development areas in chip level, package level and board level, as well as critical supporting materials and infrastructure, will be highlighted.
She will conclude her talk by addressing some select issues related to education, business and technology.
An internationally renowned authority in surface mount technology -- an area of electronic packaging technology -- Hwang is the author of more than 200 publications and five textbooks. She is a member of the National Academy of Engineering, an inductee of the Women in Technology International Hall of Fame and a fellow of ASM International.
She has received numerous awards, including a Distinguished Alumni Award from Case Western Reserve University, where she earned a doctorate; a Special Achievement Award from Kent State University; a Founder's Award from Surface Mount Technology Association; a Women of Achievement Award from the YWCA, and a U.S. Congressional Certificate of Recognition and Achievement.
For further information on the lecture, contact Deborah Chung at 645-2593, ext. 2243, or at firstname.lastname@example.org.