Cleanroom Equipment

Deposition

10/11/16
The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.
10/11/16
The Kurt J. Lesker AXXIS Electron-Beam Evaporator with Glancing Angle Deposition (GLAD) enables e-beam deposition of thin films of metals for contact layers on microelectronic devices.
10/11/16
The BOC Edwards Auto 500 electron-beam evaporation system can deposit ultra pure thin films of materials with high melting points and achieve fast deposition rates. It also features two thermal evaporation sources along with the e-beam source inside the chamber.
9/19/14
The Molecular Beam Epitaxy (MBE) System is used to grow semiconductors from group II (Zn, Mg) and group VI (Te, O) elemental sources in an ultrahigh vacuum environment. Dopants include (N, B, Ga, In, and As).  The system has six solid source effusion cells and 2 RF plasma gas sources.  This enables semiconductors, simple and complex heterostructures and nanostructures with appropriate dopants to be prepared.
8/12/14
SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.
10/11/16
The Denton Vacuum DV502A Sputter Evaporator offers DC (direct current) sputtering of metals deposited for contact layers on microelectronic devices.

Etching

10/11/16
The Trion Technology Oracle III  dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.
10/11/16
The Trion Phantom III dry etcher is designed to supply state-of-the-art plasma etch capability for single wafers, dies or parts using fluorine and oxygen based chemistries. It features both RIE and ICP RF sources.
10/11/16
The Samco RIE-1C Reactive Ion Etcher enables dry chemical etching of semiconductor or microelectronic devices and substrates.
10/11/16
The Harrick Plasma PDC-001 Plasma Cleaner serves as an excellent tool for nanoscale surface cleaning, surface preparation and surface modification/treatment.

Metrology

2/6/17
The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.
10/11/16
The Gaertner Scientific Corp. L117 Ellipsometer provides non-contact thickness and refractive index measurements of thin transparent and semi-transparent films to sub-angstrom precision.
3/23/17
The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.
3/23/17
The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM liftout, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.
10/11/16
The Alessi CPS-7089-17 4-point Probe can be used to measure film thickness, but is usually used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bare wafers.
8/12/14
Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.
8/12/14
The Süss MicroTec PM8 Probe Station enables electrical testing of semiconductor or other microelectronic devices. Features two probes with microscope and attached curve tracer for sample electrical testing, as well as heated and cooled stage by TRIOTech.
10/11/16
The KLA-Tencor Alpha-Step IQ Surface Profilometer is a mechanical, stylus-based step profiler offering a complete suite of 2-D analysis features for surface topography analysis.
10/11/16
The Tencor AlphaStep 200 Profilometer is a stylus-based surface profiler used to measure thin film thicknesses, step heights, etch depths, and micro-roughness in a range of 100 Å up to 165 microns.
8/12/14
SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.

Microscopy

3/23/17
The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.
3/23/17
The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM liftout, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.
8/12/14
Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.
8/12/14
SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.

Photolithography

10/11/16
The Alessi CPS-7089-17 4-point Probe can be used to measure film thickness, but is usually used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bare wafers.
10/28/14
The Karl Süss MJB3 Mask Aligner is designed for high resolution photolithography and can handle standard wafers, irregular substrates and variety of thicknesses.
10/11/16
OAI Model 806 MBA Mask Aligner is a photolithography system designed for front/back side alignment and proximity/contact UV exposure.
8/12/14
The Süss MicroTec PM8 Probe Station enables electrical testing of semiconductor or other microelectronic devices. Features two probes with microscope and attached curve tracer for sample electrical testing, as well as heated and cooled stage by TRIOTech.
10/11/16
The Brewer Science CEE-200 is a fully programmable spin coater intended for use as a semiconductor or optical application spin coating machine.
3/17/15
Easy-to-use spin coaters for precise and uniform deposition of thin films and coatings. They can be used to deposit metal oxide thin films, polymer coatings and metal organic thin films.
10/11/16
The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

Sample Preparation

10/13/15
Fume hoods available for sample preparation with solvents and acids.
10/11/16
The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

Surface Science

2/6/17
The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.
10/11/16
The Gaertner Scientific Corp. L117 Ellipsometer provides non-contact thickness and refractive index measurements of thin transparent and semi-transparent films to sub-angstrom precision.

Thermal Processing and Analysis

8/12/14
The Thermo Electron Corporation’s Lindberg/Blue M™ Tube Furnace is a high-temperature air or inert atmosphere 3-zone furnace.  Can be used for diffusing or annealing samples.
8/12/14
The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in less than 24 seconds using an infrared gold image furnace with a programmable digital temperature controller, a quartz glass chamber and a gas controller.

Wafer Bonding

10/13/15
The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.