Atomic Layer Deposition - Ultratech / Cambridge Nanotech Savannah S100

The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.


• Al2O3 and HfO2 depositions for thin, ultra high quality insulating layers

• Accommodates wafers up to 4” in size

• Heated chamber for deposition

• Metal and oxides deposition possible

• Computer control of deposition layers

• Fomblin oil pumped chamber


Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260


  • Internal Academic: $25
  • External Academic: $25
  • Industry: $100
For general inquiries, contact:

Donald J. Goralski
Director, Shared Instrumentation Laboratories
(716) 645-5151

For technical inquiries, contact:

Jeff Salzmann
Assistant Professor of Research, Cleanroom Manager
(716) 645-2584