Cleanroom Equipment

Deposition

  • Atomic Layer Deposition Ultratech / Cambridge Nanotech Savannah S100
    6/17/21
    The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.
  • E-Beam Evaporator with Glancing Angle Deposition (GLAD) - Kurt J. Lesker Company AXXIS
    10/11/16
    The Kurt J. Lesker AXXIS Electron-Beam Evaporator with Glancing Angle Deposition (GLAD) enables e-beam deposition of thin films of metals for contact layers on microelectronic devices.
  • E-Beam Evaporator with Thermal Evaporation Sources -BOC Edwards Auto 500
    8/28/19
    The BOC Edwards Auto 500 electron-beam evaporation system can deposit ultra pure thin films of materials with high melting points and achieve fast deposition rates. It also features two thermal evaporation sources along with the e-beam source inside the chamber.
  • Molecular Beam Epitaxy (MBE) System
    4/19/23
    The Molecular Beam Epitaxy (MBE) System is used to grow semiconductors from group II (Zn, Mg) and group VI (Te, O) elemental sources in an ultrahigh vacuum environment. Dopants include (N, B, Ga, In, and As).  The system has six solid source effusion cells and 2 RF plasma gas sources.  This enables semiconductors, simple and complex heterostructures and nanostructures with appropriate dopants to be prepared.
  • Plasma Enhanced Chemical Vapor Deposition (PECVD) System Trion Technology Minilock-Orion III
    5/18/23
    The Trion Minilock-Orion III is a PECVD system with a vacuum load-lock that produces high quality films by chemical vapor deposition method for the applications in MEMS, solid-state lighting, failure analysis and R&D.
  • Sputter Evaporator - Denton Vacuum DV502A
    4/14/23
    The Denton Vacuum DV502A Sputter Evaporator offers DC (direct current) sputtering of metals deposited for contact layers on microelectronic devices.
  • Sputtering Deposition System - Kurt J. Lesker Company® PRO Line PVD 75
    10/28/19
    The Kurt J. Lesker Company PRO Line PVD 75 is the next generation thin film deposition system based on the workhorse PVD 75 platform. 

Etching

Lithography

Metrology

  • Ellipsometer - Film Sense FS-1 Multi-Wavelength
    4/12/23
    The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.
  • Ellipsometer - Gaertner Scientific Corp. L117
    10/11/16
    The Gaertner Scientific Corp. L117 Ellipsometer provides non-contact thickness and refractive index measurements of thin transparent and semi-transparent films to sub-angstrom precision.
  • Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment - JEOL JSM-6500F
    4/4/22
    The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.
  • Focused Ion Beam Scanning Electron Microscope (FIB-SEM) - Carl Zeiss AURIGA CrossBeam
    4/14/23
    The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM lift-out, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.
  • Four Point Probe System - Jandel CYL-RM3000
    3/29/23
    The Jandel CYL-RM3000 Four Point Probe System is used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bulk wafers. It is capable of sourcing 10 nA up to 100 mA, and 0 to 1000 mV. Our probe head has 4 tips with a spacing of 1 mm apart from each other. Each tip has a radius of 40 microns and it is preset to a pressure of 60 grams of force that will be exerted on your sample. The maximum pressure is 150 grams. The unit is capable of producing 10 nA up to 100 mA with a voltage of 0 to 1000 mV.
  • Optical Microscopes: AO Epistar and Olympus BH2
    8/12/14
    Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.
  • Probe Station - Süss MicroTec PM8
    8/12/14
    The Süss MicroTec PM8 Probe Station enables electrical testing of semiconductor or other microelectronic devices. Features two probes with microscope and attached curve tracer for sample electrical testing, as well as heated and cooled stage by TRIOTech.
  • Profilometer - KLA-Tencor Alpha-Step IQ
    4/14/23
    The KLA-Tencor Alpha-Step IQ Surface Profilometer is a mechanical, stylus-based step profiler offering a complete suite of 2-D analysis features for surface topography analysis.
  • Profilometer - Tencor Alpha Step 200
    10/11/16
    The Tencor AlphaStep 200 Profilometer is a stylus-based surface profiler used to measure thin film thicknesses, step heights, etch depths, and micro-roughness in a range of 100 Å up to 165 microns.

Microscopy

  • Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment - JEOL JSM-6500F
    4/4/22
    The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.
  • Focused Ion Beam Scanning Electron Microscope (FIB-SEM) - Carl Zeiss AURIGA CrossBeam
    4/14/23
    The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM lift-out, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.
  • Optical Microscopes: AO Epistar and Olympus BH2
    8/12/14
    Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.

Photolithography

  • Four Point Probe System - Jandel CYL-RM3000
    3/29/23
    The Jandel CYL-RM3000 Four Point Probe System is used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bulk wafers. It is capable of sourcing 10 nA up to 100 mA, and 0 to 1000 mV. Our probe head has 4 tips with a spacing of 1 mm apart from each other. Each tip has a radius of 40 microns and it is preset to a pressure of 60 grams of force that will be exerted on your sample. The maximum pressure is 150 grams. The unit is capable of producing 10 nA up to 100 mA with a voltage of 0 to 1000 mV.
  • Mask Aligner (contact) - Süss MicroTec / Karl Süss MJB3
    4/14/23
    The Karl Süss MJB3 Mask Aligner is designed for high resolution photolithography and can handle standard wafers, irregular substrates and variety of thicknesses.
  • Mask Aligner – OAI 806 MBA
    3/10/21
    OAI Model 806 MBA Mask Aligner is a photolithography system designed for front/back side alignment and proximity/contact UV exposure.
  • Probe Station - Süss MicroTec PM8
    8/12/14
    The Süss MicroTec PM8 Probe Station enables electrical testing of semiconductor or other microelectronic devices. Features two probes with microscope and attached curve tracer for sample electrical testing, as well as heated and cooled stage by TRIOTech.
  • Spin Coater - Brewer Science CEE-200
    10/11/16
    The Brewer Science CEE-200 is a fully programmable spin coater intended for use as a semiconductor or optical application spin coating machine.
  • Ultraviolet Ozone Cleaning System - UVOCS T10x10/OES
    4/14/23
    The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

Sample Preparation

  • Fume Hoods
    1/21/21
    Fume hoods available for sample preparation with solvents and acids.
  • Sputter Coater System (Precious Metal - Gold) - SPI-Module
    3/30/22
    SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.
  • Ultraviolet Ozone Cleaning System - UVOCS T10x10/OES
    4/14/23
    The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

Surface Science

  • Ellipsometer - Film Sense FS-1 Multi-Wavelength
    4/12/23
    The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.
  • Ellipsometer - Gaertner Scientific Corp. L117
    10/11/16
    The Gaertner Scientific Corp. L117 Ellipsometer provides non-contact thickness and refractive index measurements of thin transparent and semi-transparent films to sub-angstrom precision.

Thermal Processing and Analysis

  • Furnace (tube) - LindbergBlue M™ - Thermo Electron Corp
    6/17/21
    The Thermo Electron Corporation’s Lindberg/Blue M™ Tube Furnace is a high-temperature air or inert atmosphere 3-zone furnace.  Can be used for diffusing or annealing samples.
  • Rapid Thermal Annealing (RTA) Vacuum Furnace - Ulvac Technology MILA 3000-P-N
    8/12/14
    The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in less than 24 seconds using an infrared gold image furnace with a programmable digital temperature controller, a quartz glass chamber and a gas controller.

Wafer Bonding

  • Aligner Wafer Bonder - AML Model AWB-04
    6/17/21
    The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.