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The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.
Aligner Wafer Bonder - AML Model AWB-04
Electrical Engineering Cleanroom Davis Hall, Suite 114 University at Buffalo North Campus Buffalo, NY 14260
Donald J. Goralski Director, Shared Instrumentation Laboratories (716) 645-5151