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Equipment and Instrumentation Portal (EQUIP)

Wafer Bonding

Aligner Wafer Bonder - AML Model AWB-04

The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.

Features

• In-situ visible and IR alignment with 1 micron accuracy
• Ultimate vacuum: 5 x 10-6 mbar
• Application of high voltages up to 2.5 kV
• Max 560°C for tungsten upper and lower platens, max 450°C for graphite upper platen (for glass bonding)
• Application of contact force up to 15 kN with tungsten platens
• Wafer size: 3" and 4"
• Forced nitrogen cooling option
• Automatic storage of all the bonding parameters and event logs for graph plotting and trend analysis

Location

Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260

Fees

Usage Fee: $25/hour (academic), $100/hour (industry)

Aligner Wafer Bonder - AML Model AWB-04

Aligner Wafer Bonder - AML Model AWB-04

For general inquiries, contact:

Donald J. Goralski

Director, Shared Instrumentation Laboratories

(716) 645-5151

 

For technical inquiries, contact:

David Eason, PhD

Technical Director, Shared Instrumentation Laboratories

(716) 645-8496