Deposition

Plasma Enhanced Chemical Vapor Deposition (PECVD) System - Trion Technology Minilock-Orion III

The Trion Minilock-Orion III is a PECVD system with a vacuum load-lock that produces high quality films by chemical vapor deposition method for the applications in MEMS, solid-state lighting, failure analysis and R&D.

Features

  • Able to deposit high quality silicon oxide (SiO2) and silicon nitride (Si3N4) films
  • Diethylsilane liquid source for Si3N4 deposition
  • Process gases
  • Oxide deposition: SiH4 + N20 +N2
  • Nitride deposition: N2 + NH3 + SiH4
  • Plasma source: 300 W, 100 kHz RF generator
  • Heated lower electrode: 50 - 400 °C controllable
  • Sample size: 3" to 200 mm single wafers or parts
  • Load lock with Automatic pressure control
  • Touch screen interface and PC process controller

Location

Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260

Fees

  • Internal Academic: $25
  • External Academic: $25
  • Industry: $100
Learn more about our rates
Zoom image: Trion Technology Minilock-Orion III - Plasma Enhanced Chemical Vapor Deposition (PECVD) System Trion Technology Minilock-Orion III - Plasma Enhanced Chemical Vapor Deposition (PECVD) System

Trion Technology Minilock-Orion III - Plasma Enhanced Chemical Vapor Deposition (PECVD) System

For general inquiries, contact:

Donald J. Goralski
Director, Shared Instrumentation Laboratories
(716) 645-5151