Wafer Bonding

Aligner Wafer Bonder - AML Model AWB-04

The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.


  • In-situ visible and IR alignment with 1 micron accuracy
  • Ultimate vacuum: 5 x 10-6 mbar
  • Application of high voltages up to 2.5 kV
  • Max 560°C for tungsten upper and lower platens, max 450°C for graphite upper platen (for glass bonding)
  • Application of contact force up to 15 kN with tungsten platens
  • Wafer size: 3" and 4"
  • Forced nitrogen cooling option
  • Automatic storage of all the bonding parameters and event logs for graph plotting and trend analysis


Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260


  • Internal Academic: $25
  • External Academic: $25
  • Industry: $100
For general inquiries, contact:

Donald J. Goralski
Director, Shared Instrumentation Laboratories
(716) 645-5151