Photolithography

Mask Aligner – OAI 806 MBA

OAI Model 806 MBA Mask Aligner is a photolithography system designed for front/back side alignment and proximity/contact UV exposure.

Features

• Enable to make both top and back side alignment by the four-camera optical system
• 350 W NUV (365 - 400 nm) mercury lamp with uniform beam size up to 4" dia and user-settable intensity levels
• Four exposure modes: soft contact, hard contact, vacuum contact, and proximity/gap
• Exposure time settable: 0.1 – 3200 sec in 0.1 sec increments
• Exposure resolution in NUV:

        o Sub-micron under vacuum contact mode
        o 2.0 micron under soft contact mode
        o 6.0 micron at 15 micron proximity/gap mode

• Mask sizes: 5” x 5” and 7” x 7”
• Mask thickness: 0.09” for 5” x 5” and 0.12” for 7” x 7”
• Substrate: 2”, 4” and 6” wafers and square substrates

Location

Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260

Fees

Usage Fee: $25/hour (academic), $100/hour (industry)

Mask Aligner – OAI 806 MBA

For general inquiries, contact:

Donald J. Goralski

Director, Shared Instrumentation Laboratories

(716) 645-5151

 

For technical inquiries, contact:

David Eason, PhD

Technical Director, Shared Instrumentation Laboratories

(716) 645-8496