Search Equipment

Find the tools you need for your next project.

We provide cost-effective access to precision laboratories, tools and equipment for electronic device development, and the study and analysis of materials. All are available for shared use by UB students and faculty, as well as researchers at other academic institutions, and those in government and industry.

This equipment database does not include the 3D/additive manufacturing equipment available in the Bonner Hall Digital Manufacturing Lab or the Furnas Hall Motion-based Driving Simulator (simRING). For additional information, please click on the appropriate lab or contact Kevin F. Hulme or Don Goralski at 716-645-5151.

A to Z list

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Equipment A-Z

10/13/15
The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.
10/26/16
The Atomic Force Microscope System - Bruker Dimension Icon with ScanAsyst® for scanning probe microscopy is capable of nanoscale surface topography and morphology measurements of a range of different surface types producing high resolution, three-dimensional images by scanning a sharp probe over the sample surface.
10/11/16
The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.
10/26/16
Chemiluminescence technique is the leading measurement method for detecting nitrogen oxides worldwide. The Eco Physics CLD 88Y et is a vacuum chemiluminescence Nitric Oxide analyzer with a digital display of the concentrations and diagnostic messages. This 800 series analyzer is modularly designed to allow the incorporation of the vacuum pump and thermal ozone scrubber inside the case of the analyzer. It has fast response time, unheated, ambient level chemiluminescence effect with a single reaction chamber. External restriction option (e) and shut off valve (t) provide for flexibility in sample flow rates.
1/5/17
The TA Instruments DSC Q20 Differential Scanning Calorimeter (DSC) module provides for calorimetric applications. This instrument allows the measurement of differential heat flow from a sample as it is heated to high temperatures.
10/11/16
The Kurt J. Lesker AXXIS Electron-Beam Evaporator with Glancing Angle Deposition (GLAD) enables e-beam deposition of thin films of metals for contact layers on microelectronic devices.
10/11/16
The BOC Edwards Auto 500 electron-beam evaporation system can deposit ultra pure thin films of materials with high melting points and achieve fast deposition rates. It also features two thermal evaporation sources along with the e-beam source inside the chamber.
2/6/17
The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.
10/11/16
The Gaertner Scientific Corp. L117 Ellipsometer provides non-contact thickness and refractive index measurements of thin transparent and semi-transparent films to sub-angstrom precision.
10/11/16
The Trion Technology Oracle III  dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.
10/11/16
The Trion Phantom III dry etcher is designed to supply state-of-the-art plasma etch capability for single wafers, dies or parts using fluorine and oxygen based chemistries. It features both RIE and ICP RF sources.
10/11/16
The Samco RIE-1C Reactive Ion Etcher enables dry chemical etching of semiconductor or microelectronic devices and substrates.
3/23/17
The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.
8/12/14
The Hitachi S4000 Field Emission Scanning Electron Microscope (FESEM) with IXRF Energy-dispersive X-ray Spectrometer (EDS) is a cold field emission SEM that is fast and easy to use. Good for microstructure and major and minor elemental analysis. 
8/12/14
The Hitachi SU70 Field Emission Scanning Electron Microscope (FESEM) with Oxford Energy-dispersive X-ray Spectrometer (EDS) is a top level research grade SEM with excellent performance both at low kV for surface imaging and at high kV for EDS analysis. Good for microstructure and major and minor elemental analysis.
10/26/16
The Cary Eclipse Spectrophotometer uses a Xenon flash lamp to measure the emission of light from samples in four modes. With superior sensitivity, high signal-to-noise ratio and fast kinetics, it captures a data point every 12.5 ms and scans at 24,000 nm/min without peak shifts. 
3/23/17
The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM liftout, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.
10/11/16
The Alessi CPS-7089-17 4-point Probe can be used to measure film thickness, but is usually used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bare wafers.
10/13/15
Fume hoods available for sample preparation with solvents and acids.
8/12/14
The Thermo Electron Corporation’s Lindberg/Blue M™ Tube Furnace is a high-temperature air or inert atmosphere 3-zone furnace.  Can be used for diffusing or annealing samples.
10/26/16
The Agilent 7890B is a state-of-art gas chromatograph (GC) that provides superior performance for all GC applications with the use of advanced electronic pneumatic control (EPC) modules and high performance GC oven temperature control. The Agilent 240 Ion Trap mass spectrometer (MS), combined with the Agilent 7890B GC, delivers exceptional performance and unsurpassed flexibility with both MS and GC options. The MS is configured in internal mode and provides both electron ionization (EI) and chemical ionization (CI). The 7693 automatic liquid sampler (ALS) works as the interface on 7890B, providing power and communications for one automatic injector and one automatic sampler tray that are easily installed without the need for alignment.
10/26/16
High performance liquid chromatography (HPLC) is a technique in analytical chemistry used to separate, identify, and quantify each component in a liquid mixture. The Agilent 1260 Infinity Quaternary HPLC offers the most flexibility for solvent selection and automation in HPLC method development, research and all HPLC applications requiring continuous access to a wide range of solvent choices. It is ideally suitable for multi-method, high-throughput workflows.
10/26/16
The Thermo Scientific iCAP 6000 Inductively Coupled Plasma Optical Emission Spectrometer (ICP-OES) enables trace metal element analysis for liquid samples.
10/28/14
The Karl Süss MJB3 Mask Aligner is designed for high resolution photolithography and can handle standard wafers, irregular substrates and variety of thicknesses.
10/11/16
OAI Model 806 MBA Mask Aligner is a photolithography system designed for front/back side alignment and proximity/contact UV exposure.
9/19/14
The Molecular Beam Epitaxy (MBE) System is used to grow semiconductors from group II (Zn, Mg) and group VI (Te, O) elemental sources in an ultrahigh vacuum environment. Dopants include (N, B, Ga, In, and As).  The system has six solid source effusion cells and 2 RF plasma gas sources.  This enables semiconductors, simple and complex heterostructures and nanostructures with appropriate dopants to be prepared.
8/12/14
Stereoscopes, bright field, dark field, polarizing incident and transmitted optics with digital cameras. 
8/12/14
Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.
10/11/16
The Harrick Plasma PDC-001 Plasma Cleaner serves as an excellent tool for nanoscale surface cleaning, surface preparation and surface modification/treatment.
10/26/16
The Micromeritics Tri-Star II Surface Area and Porosity Analyzer allows for the analysis of surface area and porosity of powders or other nano-structures.
8/12/14
The Süss MicroTec PM8 Probe Station enables electrical testing of semiconductor or other microelectronic devices. Features two probes with microscope and attached curve tracer for sample electrical testing, as well as heated and cooled stage by TRIOTech.
10/11/16
The KLA-Tencor Alpha-Step IQ Surface Profilometer is a mechanical, stylus-based step profiler offering a complete suite of 2-D analysis features for surface topography analysis.
10/11/16
The Tencor AlphaStep 200 Profilometer is a stylus-based surface profiler used to measure thin film thicknesses, step heights, etch depths, and micro-roughness in a range of 100 Å up to 165 microns.
10/26/16
The Micromeritics Accu-Pyc II 1340 Gas Pycnometer provides high-precision volume measurements and density calculations on a wide variety of powders, and solids having volumes from 0.01 to 2000 cm3.
10/26/16
The Renishaw inVia Raman Microscope can efficiently provide Raman spectra for chemical composition and structure analysis.
9/23/14
The InPhotonics InPhototeTM Portable Raman Spectrometer is useful for rapid identification of chemicals or organic compounds, whether in the field or in the laboratory.  It is a high-quality Raman spectroscopy system in a rugged, portable package, equipped with a database of forensic materials. Most samples can be measured through packaging materials (i.e. glass and plastic). It is capable of identifying chemicals regardless of form (e.g. solids, liquids, slurries). Wet samples or water-based solutions do not pose additional identification difficulties.
8/12/14
The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in less than 24 seconds using an infrared gold image furnace with a programmable digital temperature controller, a quartz glass chamber and a gas controller.
10/11/16
The Brewer Science CEE-200 is a fully programmable spin coater intended for use as a semiconductor or optical application spin coating machine.
3/17/15
Easy-to-use spin coaters for precise and uniform deposition of thin films and coatings. They can be used to deposit metal oxide thin films, polymer coatings and metal organic thin films.
8/12/14
SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.
10/11/16
The Denton Vacuum DV502A Sputter Evaporator offers DC (direct current) sputtering of metals deposited for contact layers on microelectronic devices.
10/26/16
The TA Instruments DSC SDT Q600 Thermogravimetric Analyzer (TGA) & Differential Scanning Calorimeter (DSC) provides simultaneous measurement of weight change (TGA) and true differential heat flow (DSC) on the same sample from ambient to 1300˚C.
12/1/15
ION TOF. TOF-SIMS  5, Ultra high vacuum time-of-flight mass spectrometer for chemical imaging, ion intensity mapping, depth profiling, and static mass spectra. This equipment is engineered for the characterization and analysis of smooth, flat, and solid samples. Ideal applications include analysis of glass, silicon wafers, thin polymer films such as commercial plastics, coatings, and paints. Other possible applications include particulate analysis, and geological samples, microtomed plant and animal tissue. Surface imaging with 100nm resolution is routine given idealized conditions. Excellent for failure analysis of microcircuits, micro- and nano-scale electronic devices.
10/11/16
The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.
10/26/16
The Rigaku Ultima IV is a basic XRD system for analysis of powders, solids and thin film specimens. It provides the crystal structure of materials, and includes a database of materials.
9/23/14
The Rigaku Ultima IV is a basic XRD system for analysis of powders, solids and thin film specimens. It provides the crystal structure of materials, and includes a database of materials.
9/23/14
The Innov-X Alpha 2 portable X-ray Fluorescence (pXRF) Spectrometer allows analysis in the field or of large specimens. It is used for metal alloy determination or trace element analysis of a selected group of elements. XRF Spectrometry is used to identify elements in a substance and quantify the amount of those elements present. In different modes of operation, the portable XRF can return results on major, minor and trace levels of elements. 
10/26/16
The PHI VersaProbe XPS Microprobe is a multi-technique, ultra-high vacuum surface analysis instrument that is capable of producing focused, highly monochromatic X-ray beam that can be scanned over a sample surface. The spot size can be varied between less than 10 µm (for highest spatial resolution) to 100 µm (for highest sensitivity). The field of view can be as large as 1500 µm by 1500 µm. Software for surveys, high-resolution scans, sputter depth profiles, line scans, chemical images, automated analyses, and user-defined settings are all available on multiple workstations in the laboratory. The software library allows for post-analysis data processing. Elemental limits of detection of 3-4 atom % are routinely achieved.