The Trion Technology Oracle III dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.
• Two process chambers each with a variable valved turbo pump
• Central Vacuum Transport (CVT) load lock for fast processing
• Manual loadlock allows manual loading of a single wafer
• Touch screen operator interface
Usage Fee: $25/hour (academic), $100/hour (industry)