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Etching

Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

The Trion Technology Oracle III  dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.

Features

• Two process chambers each with a variable valved turbo pump
• Central Vacuum Transport (CVT) load lock for fast processing
• Manual loadlock allows manual loading of a single wafer
• Touch screen operator interface

Location

Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260

Fees

Usage Fee: $25/hour (academic), $100/hour (industry)

Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

For general inquiries, contact:

Donald J. Goralski

Director, Shared Instrumentation Laboratories

(716) 645-5151

 

For technical inquiries, contact:

David Eason, PhD

Technical Director, Shared Instrumentation Laboratories

(716) 645-8496