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Shared Equipment & Software

The CMI provides access to UB’s vast array of shared resources to students and faculty, researchers, and other academic institutions and industry partners. Here you’ll find faculty expertise, along with access to a cost effective suite of advanced scientific and engineering equipment and instrumentation.

An overview of some of the shared resources available are outlined below: 

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Connect with our shared resources

Christopher Janson

Business Development Executive

716.888.4795

crjanson@buffalo.edu

Thin Film Deposition

UB's expertise in thin film deposition ranges from metals for contact layers on microelectronic devices to film coating methodology that can be used to deposit conformal, uniform films on substrates and more.

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Atomic Layer Deposition Ultratech/Cambridge Nanotech Savannah S100 

The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.

E-Beam Evaporator BOC Edwards Auto 500

The BOC Edwards Auto 500 Electron Beam Evaporator is a front loading system for thin metal/oxide deposition. Thin films of metals can be deposited for contact layers or dielectrics for microelectronic devices

E-Beam Evaporator with Glancing Angle Deposition (GLAD) – Kurt J. Lesker Company AXXIS

The Kurt J. Lesker AXXIS Electron-Beam Evaporator with Glancing Angle Deposition (GLAD) enables e-beam deposition of thin films of metals for contact layers on microelectronic devices.

E-Beam Evaporator with Thermal Evaporation Sources – BOC Edwards Auto 500

The BOC Edwards Auto 500 electron-beam evaporation system can deposit ultra-pure thin films of materials with high melting points and achieve fast deposition rates. It also features two thermal evaporation sources along with the e-beam source inside the chamber.

Molecular Beam Epitaxy (MBE) System

The Molecular Beam Epitaxy (MBE) System is used to grow semiconductors from group II (Zn, Mg) and group VI (Te, O) elemental sources in an ultrahigh vacuum environment. Dopants include (N, B, Ga, In, and As).  The system has six solid source effusion cells and 2 RF plasma gas sources.  This enables semiconductors, simple and complex heterostructures and nanostructures with appropriate dopants to be prepared.

Plasma Enhanced Chemical Vapor Deposition (PECVD) System TRION Technology Orion

The TRION Technology Orion Plasma Enhanced Chemical Vapor Deposition (PECVD) System enables thin deposition of thin insulating films of silicon dioxide (SiO2) on a variety of substrates.

Thermal Deposition System

The Denton Vacuum DV502A Thermal Deposition System enables thermal deposition of metals for contact layers on microelectronic devices.

Etching

UB's etching equipment is designed for semiconductor and microelectronic devices or substrates and can supply plasma etch capability for single wafers, dies or parts using fluorine and oxygen based chemistries.

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Etcher – Inductively Coupled Plasma Reactive Ion (ICP-RIE) Trion Technology Oracle III 

The Trion Technology Oracle III dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.

Etcher – Inductively Coupled Plasma Reactive Ion – (ICP-RIE) Trion Technology Phantom III 

The Trion Phantom III dry etcher is designed to supply state-of-the-art plasma etch capability for single wafers, dies or parts using fluorine and oxygen based chemistries. It features both RIE and ICP RF sources.

Etcher – Reactive Ion Etcher (RIE) Samco RIE 1C 

The Samco RIE-1C Reactive Ion Etcher enables dry chemical etching of semiconductor or microelectronic devices and substrates.

Etcher – Reactive Ion Etcher (RIE) – Torr International AT3 

The Torr International AT3 Reactive Ion Etcher enables dry chemical etching of semiconductor or microelectronic devices and substrates.

Metrology

From application analysis and system specification, UB's metrology equipment offers a variety of microstructure solutions for your company.

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Field Emission Scanning Electron Microscope (FESEM) with Electron Beam Lithography attachment – JEOL JSM 6500F

The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.

Field Emission Scanning Electron Microscope (FESEM) with IXRF Energy – Dispersive X-ray Spectrometer (EDS) – Hitachi S4000

The Hitachi S4000 Field Emission Scanning Electron Microscope (FESEM) with IXRF Energy-dispersive X-ray Spectrometer (EDS) is a cold field emission SEM that is fast and easy to use. Good for microstructure and major and minor elemental analysis. 

Field Emission Scanning Electron Microscope (FESEM) with Oxford Energy-Dispersive X-ray Spectrometer (EDS) – Hitachi Su70

The Hitachi SU70 Field Emission Scanning Electron Microscope (FESEM) with Oxford Energy-dispersive X-ray Spectrometer (EDS) is a top level research grade SEM with excellent performance both at low kV for surface imaging and at high kV for EDS analysis. Good for microstructure and major and minor elemental analysis.

Focused Ion Beam Scanning Electron Microscope (FIB-SEM) – Carl Zeiss Auriga CrossBeam

The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM liftout, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.

High Resolution Transmission Electron Microscopy – JEOL JEM 2010 HRTEM

The JEOL JEM 2010 is a high-resolution electron microscope with an accelerating voltage of 200KV, and a point resolution of 0.19 nm. The TEM provides morphology images, in either bright or dark field and the corresponding crystal structures by electron diffraction. A Gatan CCD camera and associated Digital Micrograph software provides improved lattice-resolution HRTEM capabilities and a variety of automated measurement capabilities, including real-time video recording.  Sample preparation tools (wire saw, dimpler, polishers, etc.) are also available. The HRTEM staff will provide assistance and training in electron microscopy techniques to enable research groups to pursue their research objectives.

Four Point Probe – Alessi CPS 7089-17

The Alessi CPS-7089-17 4-point Probe can be used to measure film thickness, but is usually used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bare wafers.

Spectrometry

UB's spectrometry equipment is capable of identifying chemicals regardless of form and allows for trace element impurity analysis of both liquid and solid samples.

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Inductively Coupled Plasma Emission Spectrometer (ICP-ES) Thermo Scientific iCAP 6000

The Thermo Scientific iCAP 6000 ICP Emission Spectrometer enables inductively coupled plasma analysis.  The Spectrometer allows for trace element impurity analysis of both liquid and solid samples.

Raman Spectrometer System (portable) – InPhotonics InPhotoe

The InPhotonics InPhototeTM Portable Raman Spectrometer is useful for rapid identification of chemicals or organic compounds, whether in the field or in the laboratory.  It is a high-quality Raman spectroscopy system in a rugged, portable package, equipped with a database of forensic materials. Most samples can be measured through packaging materials (i.e. glass and plastic). It is capable of identifying chemicals regardless of form (e.g. solids, liquids, slurries). Wet samples or water-based solutions do not pose additional identification difficulties.

Raman Microscope - Renishaw InVia

The Renishaw inVia Raman Microscope can efficiently provide Raman spectra for chemical composition and structure analysis.

Thermal Processing & Analysis

If you need to diffuse or anneal samples, UB has the right thermal processing equipment for you, including high temperature materials testing, analysis and more.

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Furnace (tube) – LindbergBlue M TM

The Thermo Electron Corporation’s Lindberg/Blue M™ Tube Furnace is a high-temperature air or inert atmosphere 3-zone furnace.  Can be used for diffusing or annealing samples.

Rapid Thermal Annealing (RTA) Vacuum Furnace – Ulvac Technology MILA 3000- P-N

The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in less than 24 seconds using an infrared gold image furnace with a programmable digital temperature controller, a quartz glass chamber and a gas controller.

Differential Scanning Calorimeter (DSC) – TA Instruments DSC Q20 

The TA Instruments DSC Q20 Differential Scanning Calorimeter (DSC) allows the measurement of differential heat flow from a sample as it is heated to high temperatures.

Thermogravimetric Analyzer (TGA) & Differential Scanning Calorimeter (DSC) – TA Instruments DSC SDT Q600 

The TA Instruments DSC SDT Q600 Thermogravimetric Analyzer (TGA) & Differential Scanning Calorimeter (DSC) provides simultaneous measurement of weight change (TGA) and true differential heat flow (DSC) on the same sample from ambient to 1,500˚C.

X-ray Diffraction & Fluorescence

UB's x-ray diffraction and fluorescene equipment analyzes powders, solids and thin film specimens and can identify elements in a substance and quantify the amount of elements present.

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X-ray Diffraction (XRD) System 

The Rigaku Ultima IV is a basic XRD system for analysis of powders, solids and thin film specimens. It provides the crystal structure of materials, and includes a database of materials.

X-ray Diffraction System (XRD) – Rigaku Ultima IV 

The Rigaku Ultima IV is a basic XRD system for analysis of powders, solids and thin film specimens. It provides the crystal structure of materials, and includes a database of materials.

X-ray Fluorescence (XRF) Spectrometer (portable) – Innov –X Alpha 2 

The Innov-X Alpha 2 portable X-ray Fluorescence (pXRF) Spectrometer allows analysis in the field or of large specimens. It is used for metal alloy determination or trace element analysis of a selected group of elements. XRF Spectrometry is used to identify elements in a substance and quantify the amount of those elements present. In different modes of operation, the portable XRF can return results on major, minor and trace levels of elements. 

Microscopy

UB's microscopy equipment is capable of nanoscale surface topography and morphology measurements, high resolution images of inorganic and organic surface structures, major and minor elemental analysis and more.

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Atommic Force Microscope System - Bruker Dimension Icon with ScanAsyst

The Atomic Force Microscope System - Bruker Dimension Icon with ScanAsyst® for scanning probe microscopy is capable of nanoscale surface topography and morphology measurements of a range of different surface types producing high resolution, three-dimensional images by scanning a sharp probe over the sample surface.

Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment - JEOLJSM-6500F

The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.

Field Emission Scanning Electron Microscope (FESEM) with IXRF Energy-dispersive X-ray Spectrometer (EDS) - Hitachi S4000

The Hitachi S4000 Field Emission Scanning Electron Microscope (FESEM) with IXRF Energy-dispersive X-ray Spectrometer (EDS) is a cold field emission SEM that is fast and easy to use. Good for microstructure and major and minor elemental analysis. 

Field Emission Scanning Electron Microscope (FESEM) with Oxford Energy-dispersive X-ray Spectrometer (EDS) - Hitachi SU70

The Hitachi SU70 Field Emission Scanning Electron Microscope (FESEM) with Oxford Energy-dispersive X-ray Spectrometer (EDS) is a top level research grade SEM with excellent performance both at low kV for surface imaging and at high kV for EDS analysis. Good for microstructure and major and minor elemental analysis.

Focused Ion Beam Scanning Electron Microscope (FIB-SEM) - Carl Zeiss AURIGA CrossBeam

The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM liftout, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.

Optical Microscopes

Stereoscopes, bright field, dark field, polarizing incident and transmitted optics with digital cameras. 

Optical Microscopes: AO Epistar and Olympus BH2

Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.

Sputter Coater System (Precious Metal - Gold) - SPI Module

SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.

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